Sarine Launches Quazer 3 Laser Diamond Sawing And Shaping System
April 17, 14
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The original Quazer and second generation Quazer II, introduced in 2005 and 2010 respectively, based on proprietary technology and state‐of‐the‐art green laser technology, introduced multiple breakthroughs in the sawing, cutting and shaping of rough diamonds and became the de‐facto high‐end market‐leading solutions.
The systems became essential tools for diamond manufacturers seeking a cost‐effective, high‐speed, accurate and low‐risk sawing and shaping solution with minimal weight loss.
The Quazer 3 offers a completely new control system with unique advantages, among which is a fully automated pie cutting feature, enabling accurate sawing of highly advanced sawing profiles, the firm said in a statement.
"While traditional pie cutting requires highly skilled expertise, the new Quazer 3 implements it in a simple one‐step process. Additionally, the high quality laser, married to new cutting edge motion and optical control technologies, produces a smoother girdle surface, significantly reducing subsequent polishing requirements, and the new shaping tools implemented in the QuazerTM 3 further maximize productivity while minimizing human errors.
"Sarine, with its new industry‐leading technologies, once again provides diamond manufacturers a superior solution for sawing and shaping rough diamonds. The new and enhanced Quazer 3, combined with the leading Strategist™ software, further optimizes the sawing and shaping process", said Uzi Levami, Chief Executive Officer of Sarine.
"Using this new system, our customers will be confident they are using the overall most‐advanced, cost‐effective, safest, fastest and most accurate sawing and shaping suite in the market," he added.